A new approach to thermal analysis of power devices

  title={A new approach to thermal analysis of power devices},
  author={Philippe Leturcq and J.-M. Dorkel and Andrzej Napieralski and E. Lachiver},
  journal={IEEE Transactions on Electron Devices},
With ever-increasing requirements for higher power hybrid and integrated circuits, thermal design considerations and means for thermal analysis have become of fundamental importance. A new approach for analyzing the heat flow across devices and substrates is described. Semi-analytic solutions are derived within the context of a multilayer model. These solutions are amenable to straightforward computer evaluation and can serve as a basis for computer-aided design. Important features of the heat… CONTINUE READING


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