A new and holistic modelling approach for impact of line-edge roughness on dielectric reliability

@article{Wu2017ANA,
  title={A new and holistic modelling approach for impact of line-edge roughness on dielectric reliability},
  author={E. Y. Wu and Ramachandran Muralidhar and T. M. Shaw and Baozhen Li and Ahyi Kim and J. H. Stathis and Griselda Bonilla},
  journal={2017 IEEE International Reliability Physics Symposium (IRPS)},
  year={2017},
  pages={5B-5.1-5B-5.8}
}
A new and holistic modelling methodology is developed to investigate the impact of line-edge roughness (LER) on time-dependent dielectric breakdown (TDDB). Unlike the conventional approach with a normal distribution for LER profiles [1-3], a realistic simulation of line-edge roughness (LER) profiles is carried out based on a power-spectrum density (PSD) function including the effects of both roughness and correlation-length (σ and λ). In contrast to the previous work, we show that LER roughness… CONTINUE READING

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