• Corpus ID: 246063725

A nanomechanical testing framework yielding front&rear-sided, high-resolution, microstructure-correlated SEM-DIC strain fields

  title={A nanomechanical testing framework yielding front\&rear-sided, high-resolution, microstructure-correlated SEM-DIC strain fields},
  author={Tijmen Vermeij and Jorn Verstijnen and Tim Ramirez y Cantador and Beno{\^i}t Blaysat and Jan Neggers and J. P. M. Hoefnagels},
The continuous development of new multiphase alloys with improved mechanical properties requires quantitative microstructure-resolved observation of the nanoscale deformation mechanisms at, e.g., multiphase interfaces. This calls for a combinatory approach beyond advanced testing methods such as microscale strain mapping on bulk material and micrometer sized deformation tests of single grains. We propose a nanomechanical testing framework that has been carefully designed to integrate several… 


A Uni-Axial Nano-Displacement Micro-Tensile Test of Individual Constituents from Bulk Material
For both single-phase and multiphase metallic materials, it is necessary to understand the mechanical behavior on the grain-size scale in detail to get information that is not obtainable from
Retardation of plastic instability via damage-enabled microstrain delocalization
AbstractMulti-phase microstructures with high mechanical contrast phases are prone to microscopic damage mechanisms. For ferrite–martensite dual-phase steel, for example, damage mechanisms such as
One‐step deposition of nano‐to‐micron‐scalable, high‐quality digital image correlation patterns for high‐strain in‐situ multi‐microscopy testing
Digital image correlation (DIC) is of vital importance in the field of experimental mechanics, yet producing suitable DIC patterns for demanding in‐situ (micro)mechanical tests remains challenging,
Integrated experimental-simulation analysis of stress and strain partitioning in multiphase alloys
On-wafer time-dependent high reproducibility nano-force tensile testing
Time-dependent mechanical investigations of on-wafer specimens are of interest for improving the reliability of thin metal film microdevices. This paper presents a novel methodology, addressing key