A multiscale method to predict delamination in Cu-epoxy systems in electronic packages

Abstract

The interface of epoxy molding compound (EMC) and Cu is known to be one of the weakest points in the electronic package design. Self-assembly monolayer (SAM) has been suggested as adhesion promoter of EMC-Cu system. Due to the length scale issues, traditional finite element or Molecular dynamic simulation can not individually simulate the behavior of the… (More)

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