A multilevel analytical placement for 3D ICs

@article{Cong2009AMA,
  title={A multilevel analytical placement for 3D ICs},
  author={Jason Cong and Guojie Luo},
  journal={2009 Asia and South Pacific Design Automation Conference},
  year={2009},
  pages={361-366}
}
In this paper we propose a multilevel non-linear programming based 3D placement approach that minimizes a weighted sum of total wirelength and TS via number subject to area density constraints. This approach relaxes the discrete layer assignments so that they are continuous in the z-direction and the problem can be solved by an analytical global placer. A key idea is to do the overlap removal and device layer assignment simultaneously by adding a density penalty function for both area & TS via… CONTINUE READING
Highly Cited
This paper has 44 citations. REVIEW CITATIONS