A multilevel analytical placement for 3D ICs

  title={A multilevel analytical placement for 3D ICs},
  author={Jason Cong and Guojie Luo},
  journal={2009 Asia and South Pacific Design Automation Conference},
In this paper we propose a multilevel non-linear programming based 3D placement approach that minimizes a weighted sum of total wirelength and TS via number subject to area density constraints. This approach relaxes the discrete layer assignments so that they are continuous in the z-direction and the problem can be solved by an analytical global placer. A key idea is to do the overlap removal and device layer assignment simultaneously by adding a density penalty function for both area & TS via… CONTINUE READING
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