A multiconductor transmission line methodology for global on-chip interconnect modeling and analysis

  title={A multiconductor transmission line methodology for global on-chip interconnect modeling and analysis},
  author={I. M. Elfadel and Alina Deutsch and H. Smith and B J Rubin and G. Kopcsay},
  journal={IEEE Transactions on Advanced Packaging},
This paper describes a methodology for global on-chip interconnect modeling and analysis using frequency-dependent multiconductor transmission lines. The methodology allows designers to contain the complexity of series impedance computation by transforming the generic inductance and resistance extraction problem into one of per-unit-length parameter extraction. This methodology has been embodied in a CAD tool that is now in production use by interconnect designers and complementary metal oxide… CONTINUE READING


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