A multiconductor transmission line methodology for global on-chip interconnect modeling and analysis

@article{Elfadel2004AMT,
  title={A multiconductor transmission line methodology for global on-chip interconnect modeling and analysis},
  author={I. M. Elfadel and Alina Deutsch and H. Smith and B J Rubin and G. Kopcsay},
  journal={IEEE Transactions on Advanced Packaging},
  year={2004},
  volume={27},
  pages={71-78}
}
This paper describes a methodology for global on-chip interconnect modeling and analysis using frequency-dependent multiconductor transmission lines. The methodology allows designers to contain the complexity of series impedance computation by transforming the generic inductance and resistance extraction problem into one of per-unit-length parameter extraction. This methodology has been embodied in a CAD tool that is now in production use by interconnect designers and complementary metal oxide… CONTINUE READING

Citations

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Interconnect design for a 32 nm node technology

2011 6th International Conference on Design & Technology of Integrated Systems in Nanoscale Era (DTIS) • 2011

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IEEE Transactions on Very Large Scale Integration (VLSI) Systems • 2011
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Proceedings Electronic Components and Technology, 2005. ECTC '05. • 2005
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