A miniaturized electron beam deflector and lens module with vertical interconnection using anodic bonding and Zn reflow

Abstract

An 8x8 array of electron beam deflector and lens module was developed using a vertical interconnection based on anodic bonding and Zn reflow. It was fabricated using 4 inch wafers and the size of one module is 8x8mm . A uniform electroplating condition of Zn was developed and void-free anodic bonding of Si-glass-Si which included Zn metal was confirmed by… (More)

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Cite this paper

@article{Han2007AME, title={A miniaturized electron beam deflector and lens module with vertical interconnection using anodic bonding and Zn reflow}, author={ChangHo Han and Bose Eom and Hyeon Cheol Kim and Kukjin Chun}, journal={2007 Digest of papers Microprocesses and Nanotechnology}, year={2007}, pages={62-63} }