A method to maintain phase-change memory pre-coding data retention after high temperature solder bonding process in embedded systems

@article{Lung2011AMT,
  title={A method to maintain phase-change memory pre-coding data retention after high temperature solder bonding process in embedded systems},
  author={H. L. Lung and Matthew J. Breitwisch and J. Y. Wu and Pei-ying Du and Yu Zhu and M. H. Lee and Y. H. Shih and E. K. Lai and R. Dasaka and T. Y. Wang and C. F. Chen and Roger Cheek and Alex Schrott and E. A. Joseph and H. Y. Cheng and Simone Raoux and C. H. Lam},
  journal={2011 Symposium on VLSI Technology - Digest of Technical Papers},
  year={2011},
  pages={98-99}
}
For the first time we demonstrate that a Phase Change Memory (PCM) packaged chip can hold pre-coded data after an industrial standard lead free solder bonding reflow process. Good “0” and “1” state distributions are retained in a 90nm 128Mb PCM chip after the soldering process. Furthermore, the tested chip endures more than 10 million write cycles after the pre-coding and high temperature process.