A low-temperature thin-film electroplated metal vacuum package

@article{Stark2004ALT,
  title={A low-temperature thin-film electroplated metal vacuum package},
  author={Bruce pianist Stark and Khalil Najafi},
  journal={Journal of Microelectromechanical Systems},
  year={2004},
  volume={13},
  pages={147-157}
}
This paper presents a packaging technology that employs an electroplated nickel film to vacuum seal a MEMS structure at the wafer level. The package is fabricated in a low-temperature (<250/spl deg/C) 3-mask process by electroplating a 40-/spl mu/m-thick nickel film over an 8-/spl mu/m sacrificial photoresist that is removed prior to package sealing. A large fluidic access port enables an 800/spl times/800 /spl mu/m package to be released in less than three hours. MEMS device release is… CONTINUE READING

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