A low-radix and low-diameter 3D interconnection network design

@article{Xu2009ALA,
  title={A low-radix and low-diameter 3D interconnection network design},
  author={Yi Xu and Yu Du and Bo Zhao and Xiuyi Zhou and Youtao Zhang and Jun Yang},
  journal={2009 IEEE 15th International Symposium on High Performance Computer Architecture},
  year={2009},
  pages={30-42}
}
Interconnection plays an important role in performance and power of CMP designs using deep sub-micron technology. The network-on-chip (NoCs) has been proposed as a scalable and high-bandwidth fabric for interconnect design. The advent of the 3D technology has provided further opportunity to reduce on-chip communication delay. However, the design of the 3D NoC topologies has important distinctions from 2D NoCs or off-chip interconnection networks. First, current 3D stacking technology allows… CONTINUE READING
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