A low-cost high performance GaAs MMIC package using air-cavity ceramic quad flat non-leaded package up to 40 GHz

@article{Suh2005ALH,
  title={A low-cost high performance GaAs MMIC package using air-cavity ceramic quad flat non-leaded package up to 40 GHz},
  author={Y. Suh and D. Richardson and Anna Dadello and S. J. Mahon and J. T. Harvey},
  journal={European Gallium Arsenide and Other Semiconductor Application Symposium, GAAS 2005},
  year={2005},
  pages={545-548}
}
A novel low-cost QFN (quad flat non-leaded) package is introduced for GaAs MMIC packaging. The air-cavity QFN package is designed and implemented with an HTCC process using alumina substrate. To operate the package up to 40 GHz, several key methods are proposed in this paper. A low noise and a buffer amplifier are packaged for practical application examples and compared with bare die measurements to verify the QFN package performance. A maximum of 4.5 dB insertion loss degradation occurred at… CONTINUE READING