A high end routing platform for core and edge applications based on chip to chip optical interconnect

@article{Hasharoni2013AHE,
  title={A high end routing platform for core and edge applications based on chip to chip optical interconnect},
  author={Kobi Hasharoni and Shuki Benjamin and Amir Geron and Gideon Katz and S. Y. Stepanov and Niv Margalit and Michael Mesh},
  journal={2013 Optical Fiber Communication Conference and Exposition and the National Fiber Optic Engineers Conference (OFC/NFOEC)},
  year={2013},
  pages={1-3}
}
A telecom router utilizing a parallel optical interconnect is described with the highest reported aggregate bandwidth 1.34Tb/s, and density 64Gb/s/mm2. The device is based on direct assembly of large optoelectronic III-V chips on CMOS. 
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