A finite element simulator for three-dimensional analysis of interconnect structures

@inproceedings{SabelkaAFE,
  title={A finite element simulator for three-dimensional analysis of interconnect structures},
  author={Rainer Sabelka and Siegfried Selberherr}
}
We have developed a set of simulation programs for twoand three-dimensional transient analysis of ULSI interconnects. The program package is called “Smart Analysis Programs” (SAP) and it supports capacitance and resistance extraction, quasi-electrostatic simulation (calculation of delay times and crosstalk), and coupled electro-thermal simulations. For the numerical solution of the involved partial differential equations (Euler equation, Poisson equation, heat conduction equation), we apply the… CONTINUE READING
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G

  • J. Zhang, D. Denning
  • Braeckelmann, R.Venkatraman, R. Fiordalice, E…
  • 2001
2 Excerpts

On R

  • K. Banerjee, A. Mehrotra, A. Sangiovanni-Vincentelli, C. Hu
  • Sabelka, S. Selberherr / Microelectronics Journal…
  • 2001
1 Excerpt

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