A fast simulation framework for full-chip thermo-mechanical stress and reliability analysis of through-silicon-via based 3D ICs

@article{Mitra2011AFS,
  title={A fast simulation framework for full-chip thermo-mechanical stress and reliability analysis of through-silicon-via based 3D ICs},
  author={Joydeep Mitra and Moongon Jung and Suk-Kyu Ryu and Rui Huang and S. K. Lim and David Z. Pan},
  journal={2011 IEEE 61st Electronic Components and Technology Conference (ECTC)},
  year={2011},
  pages={746-753}
}
In this work, we propose an efficient and accurate full-chip thermo-mechanical stress and reliability analysis framework. To the best of our knowledge this is the first such system which enables full-chip stress simulation as compared to existing commercial Finite Element Analysis (FEA) tools which can only simulate very small cross-sections at a time. Our approach is based on the linear superposition principle of stress tensors and the assumption that the stress field around a cylindrical TSV… CONTINUE READING
10 Citations
7 References
Similar Papers

Citations

Publications citing this paper.
Showing 1-10 of 10 extracted citations

References

Publications referenced by this paper.

Similar Papers

Loading similar papers…