A direct plasma etch approach to high aspect ratio polymer micromachining with applications in bioMEMS and CMOS-MEMS

A novel etching approach to high aspect ratio polymer micromachining is introduced. A switching chemistry utilizing oxygen as an etchant gas with a C/sub 4/F/sub 8/ passivation step has produced high aspect ratio polymer structures. Polymer layers have been bound to a mechanical silicon support, patterned and etched. The silicon is subsequently undercut… CONTINUE READING