A detailed study of yield and reliability for vacuum packages fabricated in a wafer-level Au-Si eutectic bonding process


An Au-Si eutectic wafer-level bonding process was developed for low-temperature vacuum packaging of MEMS devices. Using Au-Si eutectic bonding, devices were encapsulated by bonding a silicon cap wafer to a device wafer. Micromachined Pirani vacuum sensors were encapsulated in order to characterize the packaged pressures. These packages had cavity dimensions… (More)


6 Figures and Tables