A damage model for SnAgCu solder under thermal cycling

Abstract

As the failure of solder joints under thermal cycling is as a result of creep-fatigue damage evolution, the failure mechanism of SnAgCu solder was studied by using the theory of continuum damage mechanics (CDM) and a new damage model was proposed here. A special bimetallic load frame with single joint-shear sample was designed to simulate actual joints in… (More)

7 Figures and Tables

Topics

  • Presentations referencing similar topics