A compact model for early electromigration lifetime estimation

Abstract

A compact model for early electromigration failures in copper dual-damascene M1/via structures is proposed. The model is derived based on relevant physical effects of the early failure mode, where a rigorous void nucleation model and a simple mechanism for slit void growth are considered. As a result, a simple analytical model for the early electromigration… (More)

Topics

7 Figures and Tables

Cite this paper

@article{Orio2011ACM, title={A compact model for early electromigration lifetime estimation}, author={R. L. de Orio and Hajdin Ceric and Siegfried Selberherr}, journal={2011 International Conference on Simulation of Semiconductor Processes and Devices}, year={2011}, pages={23-26} }