A compact 4-chip package with 64 embedded dual-polarization antennas for W-band phased-array transceivers

@article{Gu2014AC4,
  title={A compact 4-chip package with 64 embedded dual-polarization antennas for W-band phased-array transceivers},
  author={Xiaoxiong Gu and Duixian Liu and Christian W. Baks and Alberto Valdes-Garcia and Ben M. Parker and Md. Rashidul Islam and Arun S. Natarajan and Scott K. Reynolds},
  journal={2014 IEEE 64th Electronic Components and Technology Conference (ECTC)},
  year={2014},
  pages={1272-1277}
}
A fully-integrated antenna-in-package (AiP) solution for W-band scalable phased-array systems is demonstrated. We present a fully operational compact W-band transceiver package with 64 dual-polarization antennas embedded in a multilayer organic substrate. This package has 12 metal layers, a size of 16.2 mm × 16.2 mm, and 292 ball-grid-array (BGA) pins with 0.4 mm pitch. Four silicon-germanium (SiGe) transceiver ICs are flip-chip attached to the package. Extensive full-wave electromagnetic… CONTINUE READING
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A 108–114 GHz 4x4 Wafer-Scale Phased Array Transmitter With High-Efficiency On-Chip Antennas

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