A characterization method for viscoelastic bulk modulus of molding compounds

Abstract

Reliability calculations of the microelectronic packages require cure dependent viscoelastic constitutive relationship for the packaging polymers in order to predict residual stress and strain fields in the final product. The residual stresses can result in the product failure due to warpage, interfacial delamination, thermal fatigue etc. The previous work… (More)

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4 Figures and Tables