• Corpus ID: 210157182

A barrier/seed system for electroless metallization on complex surfaces using (aminomethylaminoethyl)phenethyltrimethoxysilane self-assembled films

@article{Peters2020ABS,
  title={A barrier/seed system for electroless metallization on complex surfaces using (aminomethylaminoethyl)phenethyltrimethoxysilane self-assembled films},
  author={Jeremy Peters and Garon D. Ashby and Hans D. Hallen},
  journal={arXiv: Applied Physics},
  year={2020}
}
High frequency signals propagate along the edges of conductors. If the conductors are electroplated, then the seed layer forms at least one edge, so care must be taken to insure the electrical quality of these layers. In this work, we study the initial quality of SAM-based seed layers that are compatible with complex surfaces including through-silicon vias (TSVs), as are used in via-last three-dimensional semiconductor device packaging. The conformal and electrical quality of the seed metal is… 

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References

SHOWING 1-10 OF 11 REFERENCES

Nanoseeding via dual surface modification of alkyl monolayer for site-controlled electroless metallization.

In this work, an attempt to fabricate nanostructured metallization patterns on SiO(2) dielectric layers is made by using plasma-patterned self-assembled monolayers (SAMs), in conjunction with a novel aqueous seeding and electroless process, based on a plasma-dissociated, water-mediated chemical oxidation route.

Selective electroless deposition of copper on organic thin films with improved morphology.

It is demonstrated that copper can be selectively deposited on -COOH terminated SAMs with improved morphology and without penetration of copper through the organic layer, which will facilitate the development of inexpensive molecular electronics, sensors, and other nanotechological devices.

Coupled self-assembled monolayer for enhancement of Cu diffusion barrier and adhesion properties

In this work, we have demonstrated chemically coupled (3-aminopropyl)trimethoxysilane (APTMS) and 3-mercaptopropionic acid (MPA) self-assembled monolayers (SAMs) to enhance the diffusion barrier

Role of the Reducing Agent in the Electroless Deposition of Copper on Functionalized SAMs.

This work has investigated the role of amine borane reducing agents in the electroless deposition of copper on -CH3-, -OH-, and -COOH-terminated SAMs adsorbed on gold using time-of-flight secondary ion mass spectrometry, optical microscopy, and complementary MP2 calculations.

Effects of solvent on the formation of the MUA monolayer on Si and its diffusion barrier properties for Cu metallization

We investigated the effects of solvents, such as ethanol and isooctane, on self-assembly of the mercaptoundecanoic acid (MUA) monolayer on Si and its diffusion barrier properties for Cu

Deposition and Characterization of 3-Aminopropyltrimethoxysilane Monolayer Diffusion Barrier for Copper Metallization

Diffusion barrier capability of 3-aminopropyltrimethoxysilane (APTMS) against the diffusion of copper into the dielectric is studied. A self-assembled monolayer (SAM) of APTMS was deposited on