A WiMedia UWB transmitter up to 9GHz in 65nm CMOS and Wafer-Level Fabricated Package

Abstract

A 3.1–4.7GHz and 6.3–9GHz RF transmitter fabricated in a 65nm CMOS technology and packaged with a Wafer-level Fabricated Package (WFP) is presented. For high frequency and wideband performances, all the effects of package are considered and loopback paths with a power detector are implemented. A new structure of T/R switch is devised for the low noise performance of Rx and the high linearity of Tx. With these circuits, the transmitter features high linearity, low power consumption and small chip area meeting all the WiMedia PHY spec.

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Cite this paper

@article{Yim2011AWU, title={A WiMedia UWB transmitter up to 9GHz in 65nm CMOS and Wafer-Level Fabricated Package}, author={Jounghyun Yim and Byoungjoong Kang and TaeWan Kim and Won Il Ko and Heeseon Shin and Sangsoo Ko and Inhyo Ryu and Sung-Gi Yang and Jong-Dae Bae and Hojin Park}, journal={2011 IEEE Radio Frequency Integrated Circuits Symposium}, year={2011}, pages={1-4} }