A V and E-band packaged direct-conversion transceiver chipset for mobile backhaul application in SiGe technology

@article{Trotta2014AVA,
  title={A V and E-band packaged direct-conversion transceiver chipset for mobile backhaul application in SiGe technology},
  author={Saverio Trotta and Giuseppina Sapone and Reinhard Jungmaier and Abhiram Chakraborty and Jagjit S. Bal and Herbert Knapp and Hans-Peter Forstner and Nasr Ismail and Maciej Wojinowski and Ernst Seler and Mehran P. Mousavi and Dimitri Malsam},
  journal={2014 11th European Radar Conference},
  year={2014},
  pages={352-355}
}
In this paper three chipsets for mobile backhaul application in the V and E-band are presented. The chips are fabricated in a 170GHz fT SiGe production technology and housed in a wafer level package, eWLB. The three devices share the same silicon front-end. They show the same size, same architecture, and same pin interface. Thus, they enable cost efficient system designs from 57 up 86GHz. Moreover, for the first time, a packaged device is used in those wireless applications up to 86GHz. The… CONTINUE READING

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