A Unique Temporary Bond Solution Based on a Polymeric Material Tacky at Room Temperature and Highly Thermally Resistant Application Extension from 3D-SIC to FO-WLP

Abstract

Among the technological developments pushed by the adoption of Through Silicon Vias and 3D Stacked IC technologies, wafer thinning on a temporary carrier has become a critical element in device processing over the past years. First generation of adhesive materials enabled the integration of the first devices at the expense of capping the thermal budget… (More)

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