A Thermodynamic Framework for Damage Mechanics of Solder Joints

  title={A Thermodynamic Framework for Damage Mechanics of Solder Joints},
  author={Cemal Basaran and C.-Y. Yan},
  journal={Journal of Electronic Packaging},
Damage mechanics describes the degradation process that takes place in materials and structures. Traditionally, Coffin–Manson type empirical curves are used to determine the fatigue life. Damage mechanics allows us to determine the fatigue life without the need for empirical curves. The main problem in damage mechanics has always been a lack of universally agreed upon definition of a damage metric. In this paper a damage metric based on the second law of thermodynamics and statistical mechanics… 

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