A Thermodynamic Framework for Damage Mechanics of Solder Joints
@article{Basaran1998ATF,
title={A Thermodynamic Framework for Damage Mechanics of Solder Joints},
author={Cemal Basaran and C.-Y. Yan},
journal={Journal of Electronic Packaging},
year={1998},
volume={120},
pages={379-384}
}Damage mechanics describes the degradation process that takes place in materials and structures. Traditionally, Coffin–Manson type empirical curves are used to determine the fatigue life. Damage mechanics allows us to determine the fatigue life without the need for empirical curves. The main problem in damage mechanics has always been a lack of universally agreed upon definition of a damage metric. In this paper a damage metric based on the second law of thermodynamics and statistical mechanics…
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References
SHOWING 1-10 OF 43 REFERENCES
Solder Creep-Fatigue Analysis by an Energy-Partitioning Approach
- Materials Science
- 1992
This study explores the possibility of using a unified theory of creep-fatigue, similar to the Halford-Manson strain-range partitioning method, for examining the effect of cyclic temperature range on…
A nonlinear thermal stress analysis of surface mount solder joints
- Engineering40th Conference Proceedings on Electronic Components and Technology
- 1990
A set of nonlinear finite-element (FE) cyclic thermal stress analyses of leaded ceramic chip carriers (LCCC) was performed. The FE models included the geometric and elastic compliance effects…
Thermomechanical Response of Materials and Interfaces in Electronic Packaging: Part I—Unified Constitutive Model and Calibration
- Engineering, Materials Science
- 1997
The basic theory and procedures for finding parameters in the model based on laboratory test data and their values for typical solder materials are presented and the DSC shows excellent potential for unified characterization of the stress-strain-strength and failure behavior of engineering materials in electronic packaging problems.
Thermomechanical Finite Element Analysis of Problems in Electronic Packaging Using the Disturbed State Concept: Part 1—Theory and Formulation
- Engineering
- 1998
Accurate prediction of the thermomechanical cyclic behavior of joints and interfaces in semiconductor devices is essential for their reliable design. In order to understand and predict the behavior…
ISOTROPIC AND ANISOTROPIC DAMAGE VARIABLES IN CONTINUUM DAMAGE MECHANICS
- Engineering
- 1990
The present work analyzes the implication and limitation of some scalar damage models. In particular, the elastic‐damage thermodynamic potential and the effective stress concept are reexamined. It is…
Disturbed state constitutive modeling based on stress-strain and nondestructive behavior
- Materials Science
- 1996
Why Continuum Damage is Nonlocal: Micromechanics Arguments
- Physics
- 1991
The paper presents two micromechanics arguments showing that continuum damage caused by microcracking ought to be nonlocal, defined by a spatial integral. Argument I is an analysis of a simplified…
An anisotropic model of damage mechanics based on endochronic theory of plasticity
- Engineering
- 1992
In this paper, an endochronic plastic theory coupled with anisotropic damage is established from the irreversible thermodynamics where the history with plastic deformation and damage is incorporated…