A Study of Chip Top Delamination in Plastic Encapsulated Packages under Temperature Loading

@article{Kravchenko2007ASO,
  title={A Study of Chip Top Delamination in Plastic Encapsulated Packages under Temperature Loading},
  author={Grygoriy Kravchenko and Clifford Bohm},
  journal={2007 9th Electronics Packaging Technology Conference},
  year={2007},
  pages={675-679}
}
This work is focused on numerical investigation of the corner delamination behavior at the chip top surface of plastic encapsulated semiconductor packages which is induced under temperature loading. Two points of interest are pursued in this study: 1) impact of mold compound (MC) material properties and 2) influence of package geometry on the delamination behavior. For the first part we identify influence of Young's modulus and coefficient of thermal expansion (CTE) on the fracture mechanics… CONTINUE READING