A Self-Aligning Flip-Chip Assembly Method Using Sacrificial Positive Self-Alignment Structures

Abstract

A self-aligning flip-chip assembly method is described. The method is capable of correcting up to 150 μm (five times the radius of solder balls used) of initial misalignment during flip-chip assembly. Critical components of the self-alignment are four polymeric positive self-alignment structures (PSASs), which are fabricated on a substrate, and four… (More)

Topics

12 Figures and Tables

Cite this paper

@article{Yang2016ASF, title={A Self-Aligning Flip-Chip Assembly Method Using Sacrificial Positive Self-Alignment Structures}, author={Hyung Suk Yang and Chaoqi Zhang and Muhannad S. Bakir}, journal={IEEE Transactions on Components, Packaging and Manufacturing Technology}, year={2016}, volume={6}, pages={471-477} }