A Review of Current Flame Retardant Systems for Epoxy Resins

@article{Weil2004ARO,
  title={A Review of Current Flame Retardant Systems for Epoxy Resins},
  author={E. Weil and S. Levchik},
  journal={Journal of Fire Sciences},
  year={2004},
  volume={22},
  pages={25 - 40}
}
The review covers materials currently available or which appear to be in serious development, with emphasis on electrical laminates and encapsulation, and brief coverage of other applications. The dominant technology for FR-4 printed wiring boards uses tetrabromobisphenol-A reacted into the epoxy resin. Nonhalogen systems include additives such as alumina trihydrate, alumina trihydrate plus red phosphorus, and aromatic phosphates. Reactives include a dihydrooxaphosphaphenanthrene oxide and… Expand
171 Citations
Chapter 3 – Epoxy Resins
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Flame retardant epoxy resin based on bisphenol A epoxy resin modified by phosphoric acid
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