A Review of 3-D Packaging Technology

@article{AlSarawi1998ARO,
  title={A Review of 3-D Packaging Technology},
  author={Said F. Al-Sarawi and D. Abbott and P. Franzon},
  journal={IEEE Transactions on Computers},
  year={1998}
}
This paper reviews the state-of-the-art in three-dimensional (3-D) packaging technology for very large scale integration (VLSI). A number of bare dice and multichip module (MCM) stacking technologies are emerging to meet the ever increasing demands for low power consumption, low weight and compact portable systems. Vertical interconnect techniques are reviewed in detail. Technical issues such as silicon efficiency, complexity, thermal management, interconnection density, speed, power etc. are… Expand
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