A Novel High-Temperature Planar Package for SiC Multichip Phase-Leg Power Module


This paper presents the design, development, and testing of a phase-leg power module packaged by a novel planar packaging technique for high-temperature (250°C) operation. The nanosilver paste is chosen as the die-attach material as well as playing the key functions of electrically connecting the devices' pads. The electrical characteristics of the SiC… (More)

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Citations per Year

Citation Velocity: 9

Averaging 9 citations per year over the last 3 years.

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