A Novel High-Temperature Planar Package for SiC Multichip Phase-Leg Power Module

Abstract

This paper presents the design, development, and testing of a phase-leg power module packaged by a novel planar packaging technique for high-temperature (250°C) operation. The nanosilver paste is chosen as the die-attach material as well as playing the key functions of electrically connecting the devices' pads. The electrical characteristics of the SiC… (More)

21 Figures and Tables

Topics

Statistics

01020201520162017
Citations per Year

Citation Velocity: 9

Averaging 9 citations per year over the last 3 years.

Learn more about how we calculate this metric in our FAQ.
  • Presentations referencing similar topics