A Novel DBC Layout for Current Imbalance Mitigation in SiC MOSFET Multichip Power Modules

@article{Li2016AND,
  title={A Novel DBC Layout for Current Imbalance Mitigation in SiC MOSFET Multichip Power Modules},
  author={Helong Li and Stig Munk-Nielsen and Szymon Bex0327czkowski and Xiongfei Wang},
  journal={IEEE Transactions on Power Electronics},
  year={2016},
  volume={31},
  pages={8042-8045}
}
This letter proposes a novel direct bonded copper (DBC) layout for mitigating the current imbalance among the paralleled SiC MOSFET dies in multichip power modules. Compared to the traditional layout, the proposed DBC layout significantly reduces the circuit mismatch and current coupling effect, which consequently improves the current sharing among the… CONTINUE READING