A Novel Application of the FIB Lift-out Technique for 3-D TEM Analysis

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@article{Lee2001ANA, title={A Novel Application of the FIB Lift-out Technique for 3-D TEM Analysis}, author={Jon C. Lee and David Su and J. H. Chuang}, journal={Microelectronics Reliability}, year={2001}, volume={41}, pages={1551-1556} }