Corpus ID: 18338793

A New Approach for Early Detection of PCB Pad Cratering Failures

@inproceedings{Bansal2011ANA,
  title={A New Approach for Early Detection of PCB Pad Cratering Failures},
  author={A. Bansal and G. Ramakrishna and K. Liu},
  year={2011}
}
Pad cratering refers to the initiation and propagation of fine cracks beneath BGA pads in organic substrates or printed circuit boards. These cracks, which usually initiate under the application of excessive mechanical loads, represent a serious reliability concern for the industry. In typical board level reliability tests, solder joint failures are detected by an increase in electrical resistance of a daisy chain circuit followed by failure analysis. However, board level testing to determine… Expand
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9 Citations
Highly Influential Citations
1
Background Citations
6
Methods Citations
3
Results Citations
1

9 Citations

Citation Type

Citation Type

A new detection method for the onset of PCB pad cratering
  • G. Chang, M. Chen, +4 authors Tacio Chou
  • Engineering
  • 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
  • 2013
  • 2
Method for early detection of PCB bending induced pad cratering
  • 5
Pad Cratering Based Failure Criterion for the Life Prediction of Board Level Cyclic Bending Test
  • Q. Zhang, J. Lo, S. Lee
  • Materials Science
  • 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
  • 2017
  • 2
Pad Cratering Susceptibility Testing with Acoustic Emission
  • PDF
A Study of Solder Joint Failure Criteria
  • 15
Nondestructive testing method for a new generation of electronics
  • 1
  • PDF
Acoustic emission detection of BGA components in spherical bend
  • 5
Pad crater detection using acoustic waveform analysis
  • 2
  • Highly Influenced
Quality assessments of solder bump interconnections in ball grid array packages using laser ultrasonics and laser interferometer
  • 1

References

SHOWING 1-10 OF 13 REFERENCES
Failure mechanism and mitigation of PCB pad cratering
  • 13
FLEXURAL STRENGTH OF BGA SOLDER JOINTS WITH ENIG SUBSTRATE FINISH USING 4-POINT BEND TEST
  • 23
Comparison of substrate finishes for flip chip packages
  • 13
MODELING AND EXPERIMENTAL CORRELATION OF BGA SOLDER JOINTS UNDER PCB BENDING
  • 3
Acceleration factor study of lead-free solder joints under wide range thermal cycling conditions
  • 10
On the nature of pad cratering
  • 24
Effects of temperature and strain rate on the mechanical properties of lead-free solders
  • H. Ma
  • Materials Science
  • 2010
  • 16
Lead Free Assembly Impacts on Laminate Material Properties and “Pad Crater” Failures
  • IPC APEX Conference,
  • 2007
Impact of Cracking Beneath Solder Pads in Printed Circuit Boards on Reliability of Ball Grid Array Packages
  • SMTA Intl. Conference,
  • 2005
Effects of Temperature and Strain Rate on the Mechanical Properties of Lead-Free Solders”, Jl
  • Of Materials Science,
  • 2010
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