Corpus ID: 18338793

A New Approach for Early Detection of PCB Pad Cratering Failures

@inproceedings{Bansal2011ANA,
  title={A New Approach for Early Detection of PCB Pad Cratering Failures},
  author={A. Bansal and G. Ramakrishna and K. Liu},
  year={2011}
}
Pad cratering refers to the initiation and propagation of fine cracks beneath BGA pads in organic substrates or printed circuit boards. These cracks, which usually initiate under the application of excessive mechanical loads, represent a serious reliability concern for the industry. In typical board level reliability tests, solder joint failures are detected by an increase in electrical resistance of a daisy chain circuit followed by failure analysis. However, board level testing to determine… Expand
9 Citations
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