A New Analytical Thermal Model for Multilevel ULSI Interconnects Incorporating Via Effect

Abstract

This paper presents a compact analytical model for estimating the temperature rise of multilevel ULSI interconnects incorporating via effect. For the first time, an analytical expression is derived for the via correction factor, η, which quantifies the effect of via separation on the effective thermal conductivity of ILD (inter-layer dielectrics), k ILD… (More)

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Cite this paper

@inproceedings{Chiang2001ANA, title={A New Analytical Thermal Model for Multilevel ULSI Interconnects Incorporating Via Effect}, author={T. K. Chiang and Kaustav Banerjee and Krishna C. Saraswat}, year={2001} }