A Model of BGA Thermal Vias as an Example of Lumped Parameter Analysis in Thermal Modeling of SiPs and Stacked Die Packages

Abstract

In this paper, a review of the different approaches to stationary thermal analysis of stacked die packages is presented, focusing on the opportunity to develop compact models suitable to be included in the design flow. Actually, although three-dimensional integration of the heat equation by numerical methods may provide an accurate estimate of the… (More)
DOI: 10.1109/JPROC.2008.2007466

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@article{Colombo2009AMO, title={A Model of BGA Thermal Vias as an Example of Lumped Parameter Analysis in Thermal Modeling of SiPs and Stacked Die Packages}, author={Luigi Pietro Maria Colombo and Davide Paleari and Alexey Petrushin}, journal={Proceedings of the IEEE}, year={2009}, volume={97}, pages={70-77} }