A Micromachined Chip-to-Board Interconnect System Using Electroplating Bonding Technology

@article{Joung2008AMC,
  title={A Micromachined Chip-to-Board Interconnect System Using Electroplating Bonding Technology},
  author={Yeun-Ho Joung and M. G. Allen},
  journal={IEEE Transactions on Advanced Packaging},
  year={2008},
  volume={31},
  pages={357-366}
}
We demonstrate a micromachined flexible chip-to-board chip interconnect structure for a chip scale package. Micromachined flexible interconnects enable robust operation in high thermal cycling environments, even for high pinout chips due to the flexible interconnect ability to absorb thermal expansion strain. The interconnects on the chip-side and printed wiring board (PWB)-side are united by electroplating bonding technology, a direct bonding technology resulting in solder-free, underfill-free… CONTINUE READING