A Hierarchical Simulation Flow for Return-Loss Optimization of Microprocessor Package Vertical Interconnects

Abstract

Design of package- and board-level interconnects utilizing full-wave electromagnetic solvers, is becoming increasingly important owing to increased frequencies of operation, miniaturization, and reduced time to market. Thus, parameterization, optimization, and statistical analysis tools are becoming an invaluable part of a designer's armory. Leveraging a… (More)

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