A Fuzzy Method for Global Quality Index Evaluation of Solder Joints in Surface Mount Technology

Abstract

In recent years, the requirement of compact devices caused an increasing use of Surface Mount Technology. This technology guarantees the reduction of the size of electronic packages by exploiting solder joint interconnection technology. Nevertheless, parameter variations can occur during the deposition and printing of the soldering paste on a board… (More)
DOI: 10.1109/TII.2010.2076292

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