A Fully Integrated RF CMOS Front-End IC for Connectivity Applications

Abstract

A fully integrated RF CMOS front-end (FE) IC (FEIC), which is fabricated with a 0.13-μm bulk RF CMOS process for wireless local area network/Bluetooth (WLAN/BT) applications, is presented. The proposed FEIC includes a dual-mode power amplifier (PA), integrated switches, and a shared low-noise amplifier (LNA) without external matching networks. The… (More)
DOI: 10.1109/TCSII.2016.2548259

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Cite this paper

@article{Joo2016AFI, title={A Fully Integrated RF CMOS Front-End IC for Connectivity Applications}, author={Taehwan Joo and Dong-Ho Lee and Songcheol Hong}, journal={IEEE Transactions on Circuits and Systems II: Express Briefs}, year={2016}, volume={63}, pages={1024-1028} }