A Framework for TSV Serialization-aware Synthesis of Application Specific 3D Networks-on-Chip

  • Sudeep Pasricha
  • Published 2012 in 2012 25th International Conference on VLSI Design


With increasing performance-per-watt implementation requirements for emerging applications and barriers in interconnect scaling for ultra-deep sub micron (UDSM) technologies, traditional 2D integrated circuits (2D-ICs) are being pushed to their limit. Three dimensional integrated circuits (3D-ICs) have recently emerged as a promising solution that can… (More)
DOI: 10.1109/VLSID.2012.82


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