A Fourier Series-Based Analytical Solution for Three-Dimensional Conjugate Heat Transfer Problems in Microprocessor Cooling

A fully analytical steady state solution is presented for the problem of 3-D conjugate heat transfer in flip chip electronic packages with multiple general areal power sources, cooled by heatsinks using forced convection. The inherent simplicity of the proposed approach allows for expedient yet detailed package cooling/thermal analysis and evaluation of… CONTINUE READING