A Comparative Study of a Fan Out Packaged Product: Chip First and Chip Last

@article{Chen2016ACS,
  title={A Comparative Study of a Fan Out Packaged Product: Chip First and Chip Last},
  author={Scott Deeann Chen and Simon Ho Wang and John Hunt and William Chen and Leander Liang and Golden Kao and Abner Peng},
  journal={2016 IEEE 66th Electronic Components and Technology Conference (ECTC)},
  year={2016},
  pages={1483-1488}
}
This paper compares the attributes of the embedded wafer level BGA (eWLB) and a flip chip package structure, called Fan-Out Chip Last Package (FOCLP). The comparison involves a study in finite element modeling, advanced warpage metrology, reliability testing and physical structure comparisons. The purpose of this study is to understand the similarities and differences between these two package structures. It is clear from these studies that these two packages are very similar in form, format… CONTINUE READING

Citations

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Comparative Study on Electrical Performance of eWLB, M-Series and Fan-Out Chip Last

2018 IEEE 68th Electronic Components and Technology Conference (ECTC) • 2018
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Comparative Study on Mechanical and Thermal Performance of eWLB, M-Series™ and Fan-Out Chip Last Packages

2018 IEEE 68th Electronic Components and Technology Conference (ECTC) • 2018
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Design and reliability assessment of stacked fan-out packaging

2018 Pan Pacific Microelectronics Symposium (Pan Pacific) • 2018
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Warpage Tuning Study for Multi-chip Last Fan Out Wafer Level Package

2017 IEEE 67th Electronic Components and Technology Conference (ECTC) • 2017
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