A Column-Row-Parallel ASIC Architecture for 3-D Portable Medical Ultrasonic Imaging

  title={A Column-Row-Parallel ASIC Architecture for 3-D Portable Medical Ultrasonic Imaging},
  author={Kailiang Chen and Hae-Seung Lee and Charles Sodini},
  journal={IEEE Journal of Solid-State Circuits},
This paper presents a scalable column-row-parallel ASIC architecture for 3-D portable medical ultrasound. Through its programmable row-by-row or column-by-column operations for both transmit and receive beam-formation, linear scaling in interconnection, data acquisition complexity, power dissipation, and programming time is achieved. In addition, its per-element controllers can activate fine granularity aperture definition when more functionality is favored over the linear-scaling power and… CONTINUE READING


Publications citing this paper.
Showing 1-9 of 9 extracted citations

27.6 Single-chip 3072ch 2D array IC with RX analog and all-digital TX beamformer for 3D ultrasound imaging

2017 IEEE International Solid-State Circuits Conference (ISSCC) • 2017
View 2 Excerpts

A reconfigurable 24 × 40 element transceiver ASIC for compact 3D medical ultrasound probes

ESSCIRC 2017 - 43rd IEEE European Solid State Circuits Conference • 2017
View 2 Excerpts


Publications referenced by this paper.
Showing 1-10 of 32 references

3D volumetric ultrasound imaging with a 32×32 CMUT array integrated with front-end ICs using flip-chip bonding technology

2013 IEEE International Solid-State Circuits Conference Digest of Technical Papers • 2013
View 7 Excerpts
Highly Influenced

Integration of 2D CMUT arrays with front-end electronics for volumetric ultrasound imaging

IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control • 2008
View 8 Excerpts
Highly Influenced

Reconfigurable mosaic annular arrays

IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control • 2014
View 2 Excerpts

3-D ultrasound imaging performance of a row-column addressed 2-D array transducer: A measurement study

M. Rasmussen, J. Jensen
Proc. IEEE Int. Ultrason. Symp. (IUS’13), 2013, pp. 1460–1463. • 2013

Similar Papers

Loading similar papers…