A Bi-Axis Accelerometer with a Chip Size Packaging Technology for a Pacemaker Application

We present a wafer scale packaging technology which allows to integrate the sensor, its connections and encapsulation in a single package. Connection pads permit to report directly the sensor on a circuit board using surface mount technology. The process was applied to an accurate (10-3 of the 2g full scale) bi-axis accelerometer without any drift of the… CONTINUE READING