A 300-mm Silicon Photonics Platform for Large-Scale Device Integration

@article{Horikawa2018A3S,
  title={A 300-mm Silicon Photonics Platform for Large-Scale Device Integration},
  author={Tsuyoshi Horikawa and Daisuke Shimura and Hideaki Okayama and Seok-Hwan Jeong and Hiroyuki Takahashi and Jun Ushida and Yuriko Marina Sobu and Akemi Shiina and Masatoshi Tokushima and Keizo Kinoshita and Tohru Mogami},
  journal={IEEE Journal of Selected Topics in Quantum Electronics},
  year={2018},
  volume={24},
  pages={1-15}
}
A 300-mm silicon photonics platform for large-scale device integration was developed, leveraging 40-nm complementary metal-oxide-semiconductor technology. Through fabrication using this technology platform, wire waveguides were obtained with low propagation losses for the C-band (0.4 dB/cm) and O-band (1.3 dB/cm). Several types of wavelength filters, including a coupled resonator optical waveguide (CROW), an arrayed waveguide grating, and a cascaded Mach–Zehnder interferometer, were also… CONTINUE READING

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