40 μm Copper–Silver Composite Flip-Chip Interconnect Technology Using Solid-State Bonding

@inproceedings{Sha201240C,
  title={40 μm Copper–Silver Composite Flip-Chip Interconnect Technology Using Solid-State Bonding},
  author={Chu-Hsuan Sha and Wen Piao Lin and Chin C. Lee},
  year={2012}
}