3DIC system design impact, challenge and solutions

@inproceedings{Shen20143DICSD,
  title={3DIC system design impact, challenge and solutions},
  author={William Wu Shen},
  booktitle={ISPD},
  year={2014}
}
In last few decades, the semiconductor industry has advanced as Moore's law predicted. With the introduction of 3D IC, it has extended the Moore's law into another dimension. The 3DIC vast interconnecting capabilities and ultra-short die to die distance can be fully explored for high bandwidth, low power applications. These 3D IC's are capable of enhancing… CONTINUE READING