3D network-on-chip with wireless links through inductive coupling

@article{Lee20113DNW,
  title={3D network-on-chip with wireless links through inductive coupling},
  author={Jinho Lee and Mingyang Zhu and Kiyoung Choi and Jung Ho Ahn and Rohit Sharma},
  journal={2011 International SoC Design Conference},
  year={2011},
  pages={353-356}
}
Utilizing network-on-chips for manycore SoCs has already been studied widely, as traditional bus-based architectures are unlikely to endure so many inter-core communications. Since device scaling has come to a limit, the technology trend now is stacking dies three-dimensionally to obtain more silicon area and shorter wire length. The most challenging part for making a 3D chip is inter-layer communication method. Currently, TSV is the most popular and promising technique to provide the best… CONTINUE READING
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