3D multi-stacking of thin dies based on TSV and micro-inserts interconnections

@article{Souriau20123DMO,
  title={3D multi-stacking of thin dies based on TSV and micro-inserts interconnections},
  author={Jean-Charles Souriau and Laetitia Castagne and J. Liotard and Karim Inal and J. Mazuir and F. Le Texier and Gilles Fresquet and Michele Varvara and N. Launay and Barent Dubois and T. Malia},
  journal={2012 IEEE 62nd Electronic Components and Technology Conference},
  year={2012},
  pages={1047-1053}
}
This paper is dedicated to the full development of several technological modules mandatory for 3-D multiple die stacking. This includes technologies such as thinning, Through Silicon Vias (TSV) and dies interconnection. A via last approach was chosen to be compatible with die integration coming from various foundries where design, die thickness and contact pad metallurgy are predefined. The interconnection between each die is based on chip on wafer bonding and micro-inserts technology. Small… CONTINUE READING

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