3D System-on-Chip technologies for More than Moore systems
@article{Ramm20103DST, title={3D System-on-Chip technologies for More than Moore systems}, author={Peter Ramm and Armin Klumpp and Josef Weber and Maaike M. Visser Taklo}, journal={Microsystem Technologies}, year={2010}, volume={16}, pages={1051-1055} }
Abstract3D integration is a key solution to the predicted performance problems of future ICs as well as it offers extreme miniaturization and cost-effective fabrication of More than Moore products. Through silicon via (TSV) technologies enable high interconnect performance compared to 3D packaging. At present TSVs are associated with a relatively high fabrication cost, but research world wide strive to bring the cost down to an acceptable level. An example of a 3D System-on-Chip (3D-SOC…
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