3D System-on-Chip technologies for More than Moore systems

@article{Ramm20103DST,
  title={3D System-on-Chip technologies for More than Moore systems},
  author={P. Ramm and A. Klumpp and J. Weber and M. M. V. Taklo},
  journal={Microsystem Technologies},
  year={2010},
  volume={16},
  pages={1051-1055}
}
Abstract3D integration is a key solution to the predicted performance problems of future ICs as well as it offers extreme miniaturization and cost-effective fabrication of More than Moore products. Through silicon via (TSV) technologies enable high interconnect performance compared to 3D packaging. At present TSVs are associated with a relatively high fabrication cost, but research world wide strive to bring the cost down to an acceptable level. An example of a 3D System-on-Chip (3D-SOC… Expand
46 Citations

Figures from this paper

3D Integration technology: Status and application development
  • 69
  • PDF
TSV-based 3D integration fabrication technologies: An overview
  • K. Salah
  • Computer Science
  • 2014 9th International Design and Test Symposium (IDT)
  • 2014
  • 3
3-D Integration and Through-Silicon Vias in MEMS and Microsensors
  • Z. Wang
  • Materials Science
  • Journal of Microelectromechanical Systems
  • 2015
  • 50
3-D Integration of MEMS and CMOS Using Electroless Plated Nickel Through-MEMS-Vias
  • 2
Through Silicon Vias With Invar Metal Conductor for High-Temperature Applications
  • 9
  • PDF
The European 3D Technology Platform (e-CUBES)
  • 6
  • PDF
...
1
2
3
4
5
...

References

SHOWING 1-5 OF 5 REFERENCES
Through-Silicon via Technology for 3D IC
  • 22
Miniaturised Sensor Node for Tire Pressure Monitoring (e-CUBES)
  • 7
Handbook of 3D Integration
  • 288
  • PDF
SEMATECH 3-D TSV technology development
  • Proceedings of the international 3D system integration conference
  • 2008
Wafer‐Level 3D System Integration
  • 30