• DOI:10.1007/S00542-009-0976-1
• Corpus ID: 55824967

3D System-on-Chip technologies for More than Moore systems

@article{Ramm20103DST,
  title={3D System-on-Chip technologies for More than Moore systems},
  author={Peter Ramm and Armin Klumpp and Josef Weber and Maaike M. Visser Taklo},
  journal={Microsystem Technologies},
  year={2010},
  volume={16},
  pages={1051-1055}
}

• P. Ramm, A. Klumpp, +1 author M. Taklo
• Published 1 July 2010
• Engineering
• Microsystem Technologies

Abstract3D integration is a key solution to the predicted performance problems of future ICs as well as it offers extreme miniaturization and cost-effective fabrication of More than Moore products. Through silicon via (TSV) technologies enable high interconnect performance compared to 3D packaging. At present TSVs are associated with a relatively high fabrication cost, but research world wide strive to bring the cost down to an acceptable level. An example of a 3D System-on-Chip (3D-SOC) technology is to introduce a post backend-of-line TSV process as an optimized technology for heterogeneous system integration. The introduced ICV-SLID process, that combines both TSVs and bonding, enables 3D integration of fabricated devices. Reliability issues related to thermo-mechanical stress caused by the TSV formation and the bonding are considered. 3D-SOC technology choices made to realize a heterogeneous ultra-small IC stack for a wireless tire pressure monitoring system (TPMS) as an automotive application are described.