3D System-on-Chip technologies for More than Moore systems

  title={3D System-on-Chip technologies for More than Moore systems},
  author={Peter Ramm and Armin Klumpp and Josef Weber and Maaike M. Visser Taklo},
  journal={Microsystem Technologies},
Abstract3D integration is a key solution to the predicted performance problems of future ICs as well as it offers extreme miniaturization and cost-effective fabrication of More than Moore products. Through silicon via (TSV) technologies enable high interconnect performance compared to 3D packaging. At present TSVs are associated with a relatively high fabrication cost, but research world wide strive to bring the cost down to an acceptable level. An example of a 3D System-on-Chip (3D-SOC… 
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