• DOI:10.1007/S00542-009-0976-1
Corpus ID: 55824967

3D System-on-Chip technologies for More than Moore systems

@article{Ramm20103DST,
  title={3D System-on-Chip technologies for More than Moore systems},
  author={P. Ramm and A. Klumpp and J. Weber and M. M. V. Taklo},
  journal={Microsystem Technologies},
  year={2010},
  volume={16},
  pages={1051-1055}
}

P. Ramm, A. Klumpp, +1 author M. M. V. Taklo

Published 2010

Engineering

Microsystem Technologies

Abstract3D integration is a key solution to the predicted performance problems of future ICs as well as it offers extreme miniaturization and cost-effective fabrication of More than Moore products. Through silicon via (TSV) technologies enable high interconnect performance compared to 3D packaging. At present TSVs are associated with a relatively high fabrication cost, but research world wide strive to bring the cost down to an acceptable level. An example of a 3D System-on-Chip (3D-SOC… CONTINUE READING

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